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Low Voltage Intel

Xeon

™

Processor at 1.60 GHz, 2.0 GHz and 2.4 GHz

90 Datasheet

Thermal Design Power (TDP) value listed per frequency in Table 37. Thermal solutions not

designed to provide this level of thermal capability may affect the long-term reliability of the

processor and system. For more details on thermal solution design, please refer to the appropriate

processor thermal design guidelines.

The case temperature is defined at the geometric top center of the processor IHS. Analysis

indicates that real applications are unlikely to cause the processor to consume maximum power

dissipation for sustained periods of time. Intel recommends that complete thermal solution designs

target the Thermal Design Power (TDP) indicated in Table 37 instead of the maximum processor

power consumption. The Thermal Monitor feature is intended to help protect the processor in the

unlikely event that an application exceeds the TDP recommendation for a sustained period of time.

For more details on the usage of this feature, refer to Section 7.3, “Thermal Monitor” on page 96.

In all cases, the Thermal Monitor feature must be enabled for the processor to remain within

specification.

6.2 Measurements for Thermal Specifications

6.2.1 Processor Case Temperature Measurement

The maximum and minimum case temperature (T

CASE

) for the Intel

Xeon

processor is

specified in Table 37. This temperature specification is meant to help ensure proper operation of

the processor. Figure 35 on page 91 illustrates where Intel recommends TCASE thermal

measurements should be made.

Table 37. Processor Thermal Design Power

Core Frequency Thermal Design Power†

(W) Minimum T

CASE

(°C) Maximum T

CASE

(°C)

1.60 GHz 30 5 81

2.0 GHz 35 5 83

2.4 GHz 40 5 81

† Intel recommends that thermal solutions be designed utilizing the Thermal Design Power values. Refer

to the

Low Voltage Intel® Xeon™ Processor Thermal Design Guidelines for more information.

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Lenovo 59P5107 Fiche technique Page 90